Product Profile of Water Dilutable Concentrated Lapping Slurry

Water Dilutable Concentrated Lapping Slurry is formulated for the free abrasive lapping of silicon wafers and other ceramic substrates. The Concentrated Lapping Slurry has the ability to suspend and disperse aluminum oxide abrasive at low dynamic viscosities. The Slurry reduces TTV and scratch defects as well as prevents lapping plate corrosion. Water Dilutable Concentrated Lapping Slurry improves removal rates and surface finishes.

Key Features of Water Dilutable Concentrated Lapping Slurry

• Concentrated slurries with low dynamic viscosities for ease of handling
• Improves removal rates and surface finishes
• Reduces TTV and scratch defects
• Rinses easily and will not leave films or residues
• Suspension is not shear sensitive, even when diluted 1:1 with deionized water
• Prevents lapping plate corrosion
• Biodegradable and poses no environmental or health risks