Packaged Diamond Lapping Compound is available in 0-1/ 2 to 54-80 micron sizes. The Compound is used for different purposes such as- wire drawing dies, glass, tool, die makers and tool room. The Compound provides rapid, accurate lapping, polishing and super finishing. Packaged Diamond Lapping Compound is available in accurate formation and can be custom made in different grades as per specific requirements.
Applications of Packaged Diamond Lapping Compound:
