Product Profile of Industrial Wire Bonding Machine

Industrial Wire Bonding Machine covers the widest package capability range with a powerful new high frequency transducer that delivers good bond process quality and has the pre-requisite for copper and low temperature bonding. The Wire Bonding Machine has notably improved key technologies; precise hardware, intelligent software algorithms and the closed loop bond force controlling system that guarantee a stable and robust bond process and shortest cycle times. The Wire Bonding Machine is equipped with latest technologies and the unique bond head concept. Industrial Wire Bonding Machine meets the requirements of the continuously evolving IC packaging technologies and enables IC manufacturers to stay ahead of the competition.

Applications of Industrial Wire Bonding Machine:

• Contact and contact less ID cards

• Banking cards

• GSM cards

• Any other type of Smart Cards




Key Features of Industrial Wire Bonding Machine

• High speed wire bonding process
• Covers widest package capability range
• Powerful new high frequency transducer delivers good bond process quality and has the prerequisite for copper and low temperature bonding
• Improved key technologies
• Precise hardware
• Stable and robust bond process
• Shortest cycle times
• Intelligent software algorithms