Grauer & Weil India Ltd. Supplies Acid Palladium Activator for Electroless Nickel Deposition on Copper. Grauer & Weil India Ltd offers various types of engineering, chemicals, and lubricants equipment. The Acid Palladium Activator for Electroless Nickel Deposition on Copper of model name Ginplate Activator 446 is a palladium-based immersion-type process which catalyses copper surfaces without the need for galvanic or electrolytic contact initiation and provides rapid and consistent initiation in the electroless nickel. The Acid Palladium Activator for Electroless Nickel Deposition on Copper can be used for catalysing copper surfaces, especially for EN on CU as required for manufacture of SMT PCBs and also in EMI / RFI shielding operation.
