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Heat Stable Epoxy Bonded Segment Plate

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Product Category :    Industrial Insulation

Supplier                :    Sahney Kirkwood Private Limited

Key Features of Heat Stable Epoxy Bonded Segment Plate

  • Can be supplied in the form of sheets or punched segments
  • Available in stack gauged form
  • Ensures precise dimensional control on built-up commutators


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Product Profile of Heat Stable Epoxy Bonded Segment Plate

Sahney Kirkwood Ltd supplies Heat Stable Epoxy Bonded Segment Plate. Sahney Kirkwood Ltd is an ISO 9001 accredited company offering a wide range of mica paper-based rigid laminates, moulded and flexible fabricated parts and mica based tapes. The Heat Stable Epoxy Bonded Segment Plate of model number 02-97 is milled to IEC 371 thickness tolerances and has good heat stability. The Heat Stable Epoxy Bonded Segment Plate is available in different grades depending on the type of mica used and is specially suited to segment insulation in commutators of traction motors.

Key Features of Heat Stable Epoxy Bonded Segment Plate
  • Can be supplied in the form of sheets or punched segments
  • Available in stack gauged form
  • Ensures precise dimensional control on built-up commutators
  • Available in various sizes.
Product Specification of Heat Stable Epoxy Bonded Segment Plate
  • Thermal Classification:155
  • Thickness Range:0.40 - 1.85
  • Thickness Tolerance:Avg. ± 0.025
    Individual ± 0.050
  • Binder Content:03 - 05
  • Dielectric Strength:22 Min.
  • Compressibility:At R.T. - 3 max.
    At 200°C - 2 max. (as per IEC 371-2-12; at 600 kg /cm² pr.)
  • Sheet Size:1050 x 750 ± 10
    750 x 525 ± 10
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