Semikron electronics provides 100 per cent solder-free igbt modules [skim]. These igbt modules are mainly applicable for 22 to 150 kw train drive converters in electric and hybrid vehicles. These modules have a five times higher temperature cycling capability compared to modules with base plate and soldered terminals. Due to the high temperature capabilities of t-junction = 175ºc and t-ambient - 135º, one separate coolant loop can be omitted. The solder-free pressure system and an internal laminated bus cause a homogeneous current distribution. Every igbt and diode chip has its own connection to the main terminal. The connection to the driver board is also solder-free with springs for high temperature cycling and fast solder-free mounting. The chips are not soldered but sintered to achieve the high power cycling capability. The sinter joint is a thin silver layer that has a superior thermal resistance than a soldered joint and due to the high melting point of silver no joining fatigue leading to an increased service life. Since there is no base plate, the connection of the dcb to the heat sink has the ability to move with no limitation of temperature cycling reliability. Skim withstands the stringent automotive standards being highly resistant against shock and vibration stress. The packaging and connection technology of the skim module fully exploits the silicon capabilities resulting in a cost-efficient solution. Here the fast design-in is guaranteed by the standard terminal height of 17 mm and a configuration similar to other six pack modules. Two case sizes are available: skim 63 [120 x 160 mm²] and skim 93 [150 x 160 mm²].
