Product Profile of Room Temperature Curing Silver- Filled Epoxy Conductive Adhesive/Cement

Room Temperature Curing Silver- Filled Epoxy Conductive Adhesive/Cement is ideal for bonding different materials like phenol boards, glass, ceramics, alumina, graphite, silicon, aluminum, copper, silver, magnesium and other metals. Eltecks Corporation supplies Room Temperature Curing Silver- Filled Epoxy Conductive Adhesive/Cement. Eltecks Corporation offers different types of bushing capacitors, anechoic chambers, carbon-track potentiometers & presets, cermet preset potentiometers, ceramic capacitors, flexible circuits, gas & oxygen sensors conductors, heated glass windows etc. Room Temperature Curing Silver- Filled Epoxy Conductive Adhesive/Cement also be cured at 80 degree -120 degree C for 10-30 minutes; and may also be applied by brushing by, thinning with Paste.

Specifications of Room Temperature Curing Silver- Filled Epoxy Conductive Adhesive/Cement are:

• Also cured at 80 degree -120 degree C for 10-30 minutes; and may also be applied by brushing by, thinning with Paste

• Also screen printed by thinning it to the required consistency using paste

• Has a volume resistively less than 0.0004 Ohms-cms, and films have a surface resistively of less than 0.05 Ohms/sq/mil.