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High Bonding Multi Base Water Based Lamination Adhesive

High Bonding Multi Base Water Based Lamination Adhesive

Product Category :    Laminating Adhesives

Supplier                :    Bhiwadi Polymers Ltd.

Key Features of High Bonding Multi Base Water Based Lamination Adhesive

  • High Bonding
  • Moderate Viscosity
  • Good Coverage


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Product Profile of High Bonding Multi Base Water Based Lamination Adhesive

High Bonding Multi Base Water Based Lamination Adhesive has moderate viscosity and does not require to be diluted. The Water Based Lamination Adhesive, available under the brand name "CHIPKO" of model LM100 is suitable for all weather condition. Bhiwadi Polymers Ltd., an ISO 9001-2000 certified company manufactures High Bonding Multi Base Water Based Lamination Adhesive.

Bhiwadi Polymers Ltd. Offers a wide range of wood adhesive, lamination adhesive, rubber adhesive, binder, textile adhesive, PVAC emulsions, sealer, lacquer, thinner and labelling glue. The High Bonding Multi Base Water Based Lamination Adhesive is used for lamination of boards and paper to film and also for book binding and other surface laminations.

Key Features of High Bonding Multi Base Water Based Lamination Adhesive
  • High Bonding
  • Moderate Viscosity
  • Good Coverage
  • Multi Base
  • Dilutability is not necessary
  • Economical
  • All Weather Adhesive
  • Fast Drying
  • Pumpable
  • Apt Heat Resistance
  • Good Low Temperature Properties
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