Product Profile of Multi Layer Printed Circuit Board

Multi Layer Printed Circuit Board has thickness from 0.2 to 3.2 mm. The Board has line width and spacing of 6/ 6 mils. The Multi Layer Printed Circuit Board has minimum finished hole size of 0.3 mm.

Key Features of Multi Layer Printed Circuit Board

• Surface finish of solder levelling/ lead free hot air levelling/ chemical tin/ chemical gold.
• Thickness from 0.2 to 3.2 mm.
• Line width and spacing of 6/ 6 mils.
• Minimum finished hole size of 0.3 mm.