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Phosphorous Copper Anodes Balls For Electroplating

Phosphorous Copper Anodes Balls For Electroplating

Product Category :    Anode

Supplier                :    LEE Industry

Key Features of Phosphorous Copper Anodes Balls For Electroplating

  • Made from the purest electrolytically refined copper cathodes, which are melted under highly controlled conditions to guarantee even alloying
  • Copper anodes for electroplating
  • Designed to ensure low sludge development, stable copper content in plating


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Product Profile of Phosphorous Copper Anodes Balls For Electroplating

Phosphorous Copper Anodes balls for Electroplating is made from pure electrolytically refined copper cathodes, which are melted under highly controlled conditions to ensure even alloying. Phosphorous Copper Anodes are mainly used for electroplating purpose. Phosphorous Copper Anodes balls are designed to ensure low sludge development, stable copper content in plating. Phosphorous Copper Anodes for Electroplating also ensure a rapid build-up of the adherent anode film to allow problem-free start-up of a new bath and a low build-up of impurities in the bath.

LEE Industry offers Phosphorous Copper Anodes for Electroplating. LEE Industry is the supplier of copper anodes balls, superior grade.

LEE Industry with its head office located in Koparkhairane, Mumbai is headed by Mr. Nikesh Deshmukh the Proprietor of the organization. The company ensure supply of defect free products within stipulated time.It is under his leadership and guidance that the company has achieved their goals successful. His hard work and dedication has led the company to excel in their respective fields.

Applications of Phosphorous Copper Anodes for Electroplating:

  • PCB Boards
  • Electroplating industry


  • Key Features of Phosphorous Copper Anodes Balls For Electroplating
    • Made from the purest electrolytically refined copper cathodes, which are melted under highly controlled conditions to guarantee even alloying
    • Copper anodes for electroplating
    • Designed to ensure low sludge development, stable copper content in plating
    • Ensure a rapid build-up of the adherent anode film to allow problem-free start-up of a new bath and a low build-up of impurities in the bath.
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