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Multi-Layer Printed Circuit Board

Multi-Layer Printed Circuit Board

Product Category :    Printed Circuit Boards Machinery

Supplier                :    Cipsa - Tec India Pvt Ltd

Key Features of Multi-Layer Printed Circuit Board

  • Thickness of 0.8 to 3.2mm (with finished copper of 3 oz for outer layers and 2 oz for inner layers)
  • Minimum finished hole size of 0.3mm
  • Surface Finish: HASL / HAL LEAD FREE / ENIG / OSP


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Product Profile of Multi-Layer Printed Circuit Board

Multi-Layer Printed Circuit Board ensures minimum finished hole of 0.3mm size range. The Printed Circuit Board is available in a thickness of 0.8 to 3.2mm with finished copper of 3 oz for outer layers and 2 oz for inner layers. The Printed Circuit Board is made using optimum quality material and components. Multi-Layer Printed Circuit Board is available in variety of surface finishes like HASL, HAL lead free, ENIG or OSP.

Key Features of Multi-Layer Printed Circuit Board
  • Thickness of 0.8 to 3.2mm (with finished copper of 3 oz for outer layers and 2 oz for inner layers)
  • Minimum finished hole size of 0.3mm
  • Surface Finish: HASL / HAL LEAD FREE / ENIG / OSP
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