Product Profile of Industrial Grade Reflow Oven

Industrial Grade Reflow Oven can be used for through hole components by filling the holes with solder paste and inserting the component leads through the paste. The Oven has a weight of 160 kg. The Oven comes with 960 mm heating zone. The Industrial Grade Reflow Oven has 300 mm maximum width of PCB board.

Key Features of Industrial Grade Reflow Oven

• Used for through hole components by filling the holes with solder paste and inserting the component leads through the paste
• Weight of 160 kg
• Comes with 960 mm heating zone
• 300 mm maximum width of PCB board