Product Profile of Black Metallic Interface Pads

Black Metallic Interface Pads can function in different temperature ranges varying from -240 Degree C to +300 Degree C. These Inter ace Pads are used to heat sink to enhance heat conductance from the semiconductor case and speed manufacturing process. These Interface Pads are available in black metallic finish and are suitable for low-volume applications. Black Metallic Interface Pads are ideal for use with small and discrete semiconductors.

Applications of Black Metallic Interface Pads:

• Used to heat sink to enhance heat conductance from the semiconductor case and speed manufacturing process

• Suitable for low-volume applications

• Ideal for use with small and discrete semiconductors




Key Features of Black Metallic Interface Pads

• Black metallic finish
• Can function in different temperature ranges varying from -240 Degree C to +300 Degree C
• Tensile Strength: 650 PSI