Product Profile of High Density Interconnection Printed Circuit Board

High Density Interconnection Printed Circuit Board comes with option of component layout with the smallest BGA pitch. The Circuit Board is ideal for cost-effective generation of high wiring density. The Circuit Board is based on future-proof technology. High Density Interconnection Printed Circuit Board is made of quality grade material which ensures optimum durability along with long lasting trouble free service.

Key Features of High Density Interconnection Printed Circuit Board

• Option of component layout with the smallest BGA pitch
• Miniaturisation with ‘Via in Pad’ technology
• Cost-effective generation of high wiring density
• Future-proof technology – components are becoming smaller all the
• High reliability
• Reduction in inductance and capacitance effects