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Soldering/ De-Soldering Hot Air Rework Station

Soldering/ De-Soldering Hot Air Rework Station

Product Category :    Electronic Soldering Or Desoldering Components & Devices

Supplier                :    Ascomp Inc

Key Features of Soldering/ De-Soldering Hot Air Rework Station

  • High quality heating material produces high temperature air, precise controlling BGA soldering and de-soldering
  • Movable heater can move to all direction for easy operation
  • Upper/ lower hot air set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation


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Product Profile of Soldering/ De-Soldering Hot Air Rework Station

Soldering/ De-Soldering Hot Air Rework Station is controlled by meter and can repair all kinds of chips in computer such as south-north bridge chip of mother board, display card, cell phone, digital camera, projector and games player equipments and tools. The Rework Station is available with high quality heating material that produces high temperature air, precise controlling BGA soldering and de-soldering. The Rework Station is attached with movable heater that can move to all direction for easy operation. Soldering/ De-Soldering Hot Air Rework Station comes with multi-function PCB fixing frame which locates PCB quickly and conveniently as well as suitable for irregular shape board.

Applications of Soldering/ De-Soldering Hot Air Rework Station:

  • South-north bridge chip of mother board
  • Display card
  • Cell phone
  • Digital camera
  • Projector
  • Games player equipment


  • Key Features of Soldering/ De-Soldering Hot Air Rework Station
    • High quality heating material produces high temperature air, precise controlling BGA soldering and de-soldering
    • Movable heater can move to all direction for easy operation
    • Upper/ lower hot air set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation
    • Upper hot air 8 segment temperature up/ down and 8 segment constant temperature control with 10 groups temperature setting savable. Lower hot air 8 segments temperature up/ down and 8 segments constant temperature control with 10 groups temperature setting savable and computer communication function is provided
    • BGA soldering zone supporting frame can be fine adjusted the height to prevents the depression of soldering area
    • Multi-function PCB fixing frame locates PCB quickly and conveniently as well as suitable for irregular shape board
    • Powerful cross flow fan cools down lower heating zone instantly
    • Beep alarming function when soldering or de-soldering finished
    • Hand vacuum suction pen picks away BGA easily
    • Equipped with over temperature alarming and protection function for both upper and lower heating zone
    • Equipped with a couple of different sizes alloy nozzles that are easy to be replaced and can be customized based on practical needs
    • Solid status relay caution light secures safe temperature controlling
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