Product Profile of High Density Non –Woven PCB Brush

High Density Non –Woven PCB Brush comprises of various features like high performance, greater reliability, higher density, fine pattern and multi-layer construction. The PCB Brush is utilized in different electronics industries. The PCB Brush is available in various inner diameter, outer diameter and widths as per specific requirements. High Density Non –Woven PCB Brush is ideal for cleaning heavy oxide from laminate and cleaning prior to dry film resist. Salient features of High Density Non –Woven PCB Brush: High performance Greater reliability Higher density Fine pattern Multi-layer construction Comes in 125mm X 450 and 610mm sizes

Applications of High Density Non –Woven PCB Brush:

• Cleaning heavy oxide from laminate.

• Cleaning prior to dry film resist.

• Cleaning prior to electrolytes copper plate.

• Surface conditioning after electrolytic plated copper.

• Cleaning before assembly soldering.

• Surface conditioning before printing on the backside.

• PCB cleaning and scrubbing machine.