Product Profile of Automatic Potato Wafer Cutting/ Slicing Machine

Automatic Potato Wafer Cutting/ Slicing Machine is mainly used for making plain chips, ruffle chips, lays type chips, thick salli and thin salli. The Wafer Cutting/ Slicing Machine is fabricated using quality grade raw material which ensures durability of use along with long lasting trouble free service. The Wafer Cutting/ Slicing Machine is available in application specific design and has accurate dimension. Automatic Potato Wafer Cutting/ Slicing Machine is available in different capacity ranges as per specific requirements.

Automatic Potato Wafer Cutting/ Slicing Machine has the following features:

• Fabricated using quality grade raw material which ensures durability of use along with long lasting trouble free service.

• Available in application specific design and has accurate dimension.

• Comes in different capacity ranges.


Applications of Automatic Potato Wafer Cutting/ Slicing Machine:

• Plain chips.

• Ruffle chips.

• Lays type chips.

• Thick salli.

• Thin salli.