Product Profile of Small-Footprint Inline Cleaning System

Small-Footprint Inline Cleaning System is designed or utilizing centrifugal force to enhance cleaning and drying and is ideal for densely packaged assemblies and semiconductor applications. The Inline Cleaning System has the ability to clean and dry in tight spaces that makes it suitable for medical, optical and precision cleaning requirements. The Inline Cleaning System is engineered to provide high performance, short cycle times, zero discharge and the capability to use a wide variety of aqueous and solvent-based cleaning media. The Small-Footprint Inline Cleaning System facilitates typical cycle times from wash to dry.

Applications of the Small-Footprint Inline Cleaning System:

• Wafer bumping

• Flip chips

• CSPs

• BGAs

• MCMs




Key Features of Small-Footprint Inline Cleaning System

• Handles most cleaning solvents
• Unparalleled cleaning: Ionic contamination of 0.00 micrograms/ inch, surface insulation resistance greater than 1014 ohms/square, and no visible residue
• Zero Discharge System automatically removes solvents from used rinse water and returns to wash reservoir for reuse - no drain is required
• Typical cycle times from wash to dry: PCB, BGA apps - 3.5 to 7 minutes or Flip-chip, bumper wafer apps - 7 to 15 minutes
• Small footprint