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Low Temperature Curing Ceramic Adhesive Cement

Low Temperature Curing Ceramic Adhesive Cement

Product Category :    Adhesive & Sealing Cement

Supplier                :    H. K. Shah & Co.

Key Features of Low Temperature Curing Ceramic Adhesive Cement

  • Offered in micro finned powder form that offers high bonding strength, thermal shock resistance and hard surface properties
  • Ideal for high-low temperature cementing, sealing of ceramics, refractory and glass to metals
  • Chemically resistant to all kind of acids and alkalis except hydrofluoric acid


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Product Profile of Low Temperature Curing Ceramic Adhesive Cement

Low Temperature Curing Ceramic Adhesive Cement is offered in micro finned powder form that offers high bonding strength, thermal shock resistance and has hard surface properties. The Ceramic Adhesive Cement is ideal for high-low temperature cementing, sealing of ceramics, refractory and glass to metals. The Ceramic Adhesive Cement is chemically resistant to all kind of acids and alkalis except hydrofluoric acid. Low Temperature Curing Ceramic Adhesive Cement offers high compressive strength of 3400 PSI.

H.K. Shah & Co. Manufactures Low Temperature Curing Ceramic Adhesive Cement. H.K. Shah & Co. Offers wide range of thermocouples, temperature sensors, electrical panel components, digital thermometer, temperature probes, temperature transmitter and various types of heating elements for industrial applications.

Key Features of Low Temperature Curing Ceramic Adhesive Cement
  • Offered in micro finned powder form that offers high bonding strength, thermal shock resistance and hard surface properties
  • Ideal for high-low temperature cementing, sealing of ceramics, refractory and glass to metals
  • Chemically resistant to all kind of acids and alkalis except hydrofluoric acid
  • Offers high compressive strength of 3400 PSI
Product Specification of Low Temperature Curing Ceramic Adhesive Cement
  • Chemical Composition:Alumina Based
  • Colour:White
  • Compressive Strength:3400PSI
  • Density:2.44grms / CC
  • Service Temperature:1500°C
  • Shrinkage:0.5 - 1.5%
  • Thermal Expansion:Co-Efficient of Thermal Expansion (100-500°) - 13.5 x 10-6 CM/CM/C
  • Dielectric Strength:45 volts/MIL
  • Dielectric Constant:8
  • Resistivity:3 x 10* OHM - CM
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Low Temperature Curing Ceramic Adhesive Cement - Indian Products Directory