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Advanced Thermo Logic Protections With High Temperature Resistance

Advanced Thermo Logic Protections With High Temperature Resistance

Product Category :    Insulation Materials & Elements

Supplier                :    Sunsulate Insulation Pvt. Ltd.

Key Features of Advanced Thermo Logic Protections with High Temperature Resistance

  • Ultra- tempered bubble barrier protection
  • Poly olefin base bonding substrate
  • Weather-guard-therm foam


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Product Profile of Advanced Thermo Logic Protections with High Temperature Resistance

Sunsulate Insulation Pvt Ltd manufactures Advanced Thermo Logic Protections with High Temperature Resistance. Sunsulate Insulation Pvt Ltd supplies is an ISO 9001-2000 certified company. The Advanced Thermo Logic Protections with High Temperature Resistance find application in different Warehouses, Cooling Chambers, Refrigerated Containers & Rooms and Defense Tanks. The Advanced Thermo Logic Protection have features like high temperature resistance, excellent resistance from algae and bacteria, durable and application specific design. The Advanced Thermo Logic Protections with high temperature resistance are durable, eco-friendly, recyclable and superior-performing materials derived from polyethylene.

Technical Specifications of Advanced Thermo Logic Protections with High Temperature Resistance are:

  • Product Thickness [mm]: 18
  • Temperature Range [0C]: -80 to +90
  • Thermal Resistance [R+Ft2. H.F/BTU]: 13.01
  • Thermal Conductivity [K-BTU/Ft. H.F.]: 0.016
  • Thermal Reduction [%]: 87
  • Moisture Absorption [%]: 2.1
  • Resistance to Mold. Algae and Bacteria: Excellent
  • Energy Cost Savings [%]: 71

  • Key Features of Advanced Thermo Logic Protections with High Temperature Resistance
    • Ultra- tempered bubble barrier protection
    • Poly olefin base bonding substrate
    • Weather-guard-therm foam
    • Poly olefin base bonding substrate
    • Ultra- tempered bubble barrier protection
    • Poly olefin base bonding
    • Insulative thermo-set bonding substrate
    • Hi pure aluminium metal foil
    • Poly olefin base bonding substrate
    • Hi pure aluminium metal foil
Product Specification of Advanced Thermo Logic Protections with High Temperature Resistance
  • Product Thickness:18
  • Temperature Range:-80 to +90
  • Thermal Conductivity:0.016 (K-BTU/Ft. h.f.)
  • Thermal Reduction:87 %
  • Thermal Resistance:13.01 (R+Ft2. h.F/BTU)
  • Energy Cost Savings:71 %
  • Moisture Absorption:2.1 %
  • Resistance to Mold. Algae and Bacteria:Excellent
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