R & D Engineers offers 1700 x 940 x 1150 mm Automatic Wafer Cutting Machine. R & D Engineers is an ISO 9001: 2000 certified company. The 1700 x 940 x 1150 mm [L x W x H] Automatic Wafer Cutting Machine can handle different size of wafer sheets [230 mm x 290 mm, and 290 x 460 mm]. These are fully automatic machines for cutting flat and hollow wafers filled with cream. In the cutting operation, the wafer book are first pushed through one set of cutters and then at a right angle [perpendicular] through a second set of cutters. Fixed and tensioned cutting wires in removable frames are also used. This 1700 x 940 x 1150 mm Automatic Wafer Cutting Machines are designed for high-capacity plants. The model numbers of this machine are WC1 and WC 2.
Specifications of 1700 x 940 x 1150 mm Automatic Wafer Cutting Machine is: