Kyocera wireless corporation offers a small, lightweight surface acoustic wave [saw] duplexer. Kyocera corporation has developed duplexer sd25 series of chip size package [csp] with a built-in matching circuit featuring better attenuation and isolation characteristics. The company has evolved with this brand new series using its simulation technology that mounts minimised saw element directly on ceramic substrate, seals it and coats it with resin. The duplexer has been made as small as 2.5mm x 2.0mm x 0.8mm by optimizing the combination of the saw element and the substrate. The products have two different specifications -one for japanese cdma gapan cdma band] and the other for north american cdma [cellular band].
