Product Profile of Industrial Purpose Wafer Cutting Machine

Industrial Purpose Wafer Cutting Machine has integrated system, which is designed for cutting wafer blocks and spreading cream by using steel knives or cutting wires. The Wafer Cutting Machine is available with easily-changed cutting mould. The Wafer Cutting Machine has transparent mica on lids in order to provide safety. Industrial Purpose Wafer Cutting Machine ensures efficient performance for longer period of time.

Key Features of Industrial Purpose Wafer Cutting Machine

• Available with easily-changed cutting mould
• Have integrated system, which is designed for cutting wafer blocks and spreading cream by using steel knives or cutting wires
• There is transparent mica on lids in order to provide safety
• Initially, wafer blocks pass through the first cutting cage, and then moved to the second cutting cage
• There are channels for cut wastes on sides of wafer blocks