Product Profile of UV-Tape for Wafer Dicing

Triton Consulting India offers UV-Tape for Wafer Dicing. Triton Consulting India supplies wide ranges of telecommunication, electronics, automobile, energy products of Furukawa Electric. UV-Tape for Wafer Dicing is basically adhesive tapes, prevents chip flying and makes it possible to minimize chipping during dicing. UV-Tape for Wafer Dicing`s adhesive becomes non-sticky when exposed to UV light.

UV-Tape for Wafer Dicing has the following features:

• High adhesion secures dies in place and avoids chip flying and chipping during dicing.

• Characteristics of near zero adhesion after UV irradiation makes it possible to pick up dies free of stress.

• Specially designed adhesive makes easy die-pick-up possible, regardless of kinds of wafer surface.

• No contamination with harmful ionic substances or with migration of adhesive and its additives.