Product Profile of UV-Tape for Wafer Back Grinding & Etching
Triton Consulting India supplies UV-Tape for Wafer Back Grinding & Etching. Triton Consulting India offers wide ranges of telecommunication, electronics, automobile, energy products of Furukawa Electric. UV-Tape for Wafer Back Grinding & Etching is adhesive tapes that have strong adhesive strength. UV-Tape for Wafer Back Grinding & Etching excellent shock and vibration absorption protects the wafer against breakage and damage during back grinding. UV-Tape for Wafer Back Grinding & Etching is acid resistant.
Key Features of UV-Tape for Wafer Back Grinding & Etching
- High adhesion prevents wafer breakage caused by delaminating of tape due to lack of tackiness.
- Hardness of backing film and adhesive is controlled to optimize shock and vibration absorption.
- Strong resistance to acid enchants makes it possible to eliminate resist-process.
- Characteristics of near zero adhesion after UV irradiation eliminate possibility of residues and wafer breakage.
- Consisting of strictly selected raw materials, contains little impurities and provides virtually no contamination.
