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Uv-Tape For Bga/Csp Package Dicing

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Product Category :    Electrical Insulation Tapes

Supplier                :    Triton Consulting India

Key Features of UV-Tape for BGA/CSP Package Dicing

  • High tuck strength avoids package flying during dicing.
  • Characteristics of near zero adhesion after UV irradiation makes it possible to pick up diced package easily
  • No peeling of ink marking.


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Product Profile of UV-Tape for BGA/CSP Package Dicing

Triton Consulting India supplies UV-Tape for BGA/CSP Package Dicing. Triton Consulting India offers wide ranges of telecommunication, electronics, automobile, energy products of Furukawa Electric. UV-Tape for BGA/CSP Package Dicing is adhesive tapes that have strong adhesive strength. UV-Tape for BGA/CSP Package Dicing can settle the wafers surely with the strong adhesive strength in the wafer dicing or grinding.

Key Features of UV-Tape for BGA/CSP Package Dicing
  • High tuck strength avoids package flying during dicing.
  • Characteristics of near zero adhesion after UV irradiation makes it possible to pick up diced package easily
  • No peeling of ink marking.
  • No adhesive residue in the laser marking area.
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