Product Profile of Epoxy Resin System For Void Free Encapsulation And Castings

Electrocoating and Insulation Technologies Private Limited brings Epoxy Resin System for Void Free Encapsulation and Castings. The company is engaged in developing and manufacturing various types of polymer coatings. The Epoxy Resin System for Void Free Encapsulation and Castings is a ready to use filled system. The Epoxy Resin System for Void Free Encapsulation and Castings has low viscosity at processing temperature. The Epoxy Resin System for Void Free Encapsulation and Castings is incorporated with special anti settling agents for avoiding heavy settling on storage. This Epoxy Resin System for Void Free Encapsulation and Castings is applicable with Heat curing hardeners or room temperature curing Hardener.

The Epoxy Resin System for Void Free Encapsulation and Castings has the following key features:

• Increased thermal conductivity.

• Reduced shrinkage and exotherm.

• Low coefficient of liner expansion.

• Good adhesion to most organic and inorganic materials.

• Good mechanical and electrical properties combined with good chemical and water resistance.
The Epoxy Resin System for Void Free Encapsulation and Castings is applicable for:

• Cable joint insulation.

• Topping of capacitors as sealent.

• Potting of instrument transformers.

• Casting of switch gear components and insulators.

• Casting, Potting and sealing of small and medium sized electrical and electronic components.