Product Profile of Epoxy Adhesive Epi -bond System

Electrocoating and Insulation Technologies Private Limited is offering Epoxy Adhesive EPI-Bond System. The company is engaged in developing and manufacturing various types of polymer coatings. The Epoxy Adhesive EPI -BOND is two part system comprising EPI Bond -A [Resin Part] and EPI Bond - B [Hardner Part]. This Epoxy Adhesive EPI-Bond is an adhesive system with two components for high bond strength applications. The Epoxy Adhesive EPI-Bond is available in 1 kg Polycontainer for Resin & 0.8 kgs for Hardener.

The Epoxy Adhesive EPI-Bond System has some salient features like:

• Excellent adhesion to all materials.

• Excellent electrical insulating properties.

• High adhesive, tensile and share strength.

• Thixotropic flow characteristics, useful for vertical surface.

• Cured mass tough and elastic with high resistance to impact stress.
Application of this Epoxy Adhesive EPI-Bond System:

• Fixing of break liners

• Bonding of Ferrites, Magnetics

• Joining wooden and metal patterns