Product Profile of Diode Laser Scribing Machine

Diode Laser Scribing Machine is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet of maximum 0.5 mm thickness range. The Scribing Machine finds application in solar energy, semiconductor and electronics industries. The Laser Scribing Machine is featured with auto cooling system to facilitate ease of operation. Diode Laser Scribing Machine enables high-speed scribing in a range of up to 120 mm/s and ensures very low-defective index.

Applications of Diode Laser Scribing Machine:

• Solar energy industry

• Semiconductor industry

• Electronics industry



Key Features of Diode Laser Scribing Machine

• Good beam quality and system reliability
• High-speed scribing (up to 120 mm/s), very low-defective index
• Auto cooling system
• Precise CNC worktable
• Friendly man-machine interface and simple software operation system