Pako communications offers lanner embedded platform, imb-x63- atx via c3- industrial main board with vga/lan/ddr/audio/cfii. Industrial pcs are manufactured at a fully automatic, iso 9001 manufacturing facility of 35000-sq.Ft area of lanner taiwan. Features: low power via cpl on atx main-board support cpu; via eden fan-less cpu up to 733 mhz: via low power c3 cpu up to 1 ghz; two dimm sockets, support up to 2 gb sdram: via cle266 chipset: integrated agp 4x 2d/3d graphic: 6-channel ac97 audio, dual lan: one compact flash socket: 3 pci and 4 isa slots.
