Product Profile of Wire Polishing Machines

Mikrotek Machines Limited manufactures Wire Polishing Machines. The product Wire Polishing Machines as designed and developed by Mikrotek Machines Limited are used for polishing Natural, Mono and Polycrystalline Diamond Dies. The Wire Polishing Machines are developed with high speed, individual controls, wire tension adjustment and oscillation of dies. These machines are versatile and user friendly. The Wire Polishing Machines come in various models such as:

• WPA 1S/ 2 S/ 3 S is automatic and medium type machine with 1/2/3 spindles and size range up to 2.50 mm

• WPA 1S/ 2 S is a fine and automatic type machine with 1/2 spindles available in size range up to 0.80 mm

• WPA 1S is available with 1 spindle machine and size range up to 10.00 mm

• WPA 3S include a manual to medium type 3 spindle machine. The WPA 3S model is available in size up to 1.50 mm.