Reactive Ion Etching System has anodized aluminium based planar electrode assembly for uniform gas flow dynamics. The Etching System has interchangeable substrate holder assembly to accommodate various substrate sizes and has fully automatic PLC PC based control with recipie programming. The Etching System has gas manifold with mass flow controllers for precise process control and has capacitance diaphragm gauge and variable conductance valve for closed loop pressure control. The Reactive Ion Etching System has safety interlocks for operator safety and PLC PC based automation for process control.
