Twin engineers supplies an infrared reflow machine with shuttle transfer system for soldering smds on pcbs up to 200 x 200 rnm. The system incorporates new concept of carrier return system. With this, the circuit board is transported via a thermally optimised 0.08 mm thick ptfe glass fibre. The machine has medium wave ir panels for heating and includes a 3-chamber system. In chamber 1 [pre-heat], melting and deoxidizing of solder paste takes place. In chamber 2 [reflow], soldering takes place, whereas in chamber 3 [cooling], slow heat reduction to ambient temperature is achieved. Using pid controller and thyristorised power regulator can control the temperature from 30°c to 250°c. The machine effectively solders and creates a reliable and effective interconnection of the components to the pcb substrate, thereby reducing the pcb failure rate and assuring a high level of performance. It includes benefits such as reduced thermal stress of the components, prevention of shadowing due to even heat source, and-soldering time of approximately 60-120 seconds.
